Advanced micro air-cooling systems for high density packaging
- 17 December 2002
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
No abstract availableKeywords
This publication has 8 references indexed in Scilit:
- Thermal Conductivity and Operating Temperature Effect on the Interline Region in a Micro/Miniature Heat PipePublished by ASME International ,2008
- Narrow channel heat sink for cooling of high powered electronic componentsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- Trends in cooling technology for high-density packagingPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- High performance micro-channel air coolingPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Application and Performance of Si-Microcooling Systems for Electronic DevicesPublished by Springer Nature ,1994
- Experimental Investigation of Micro Heat Pipes Fabricated in Silicon WafersJournal of Heat Transfer, 1993
- Narrow Channel Forced Air Heat SinkIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1984
- High-performance heat sinking for VLSIIEEE Electron Device Letters, 1981