Nanoindentation of Soft Films on Hard Substrates:The Importance of Pile-Up
- 1 January 1996
- journal article
- Published by Springer Nature in MRS Proceedings
Abstract
No abstract availableKeywords
This publication has 12 references indexed in Scilit:
- Influences of stress on the measurement of mechanical properties using nanoindentation: Part II. Finite element simulationsJournal of Materials Research, 1996
- Influences of stress on the measurement of mechanical properties using nanoindentation: Part I. Experimental studies in an aluminum alloyJournal of Materials Research, 1996
- An improved technique for determining hardness and elastic modulus using load and displacement sensing indentation experimentsJournal of Materials Research, 1992
- Effect of residual stress and adhesion on the hardness of copper films deposited on siliconJournal of Materials Research, 1990
- Mechanical Properties of Coatings and InterfacesMRS Proceedings, 1990
- An investigation of hardness and adhesion of sputter-deposited aluminum on silicon by utilizing a continuous indentation testJournal of Materials Research, 1988
- Stresses and deformation processes in thin films on substratesCritical Reviews in Solid State and Materials Sciences, 1988
- The mechanical properties of wear-resistant coatingsThin Solid Films, 1987
- The mechanical properties of wear-resistant coatingsThin Solid Films, 1987
- A method for interpreting the data from depth-sensing indentation instrumentsJournal of Materials Research, 1986