Stresses and deformation processes in thin films on substrates
- 1 January 1988
- journal article
- research article
- Published by Taylor & Francis in Critical Reviews in Solid State and Materials Sciences
- Vol. 14 (3) , 225-268
- https://doi.org/10.1080/10408438808243734
Abstract
The stresses that develop in thin films on substrates can be detrimental to the reliability of thin film electronic devices. In order to design these devices for improved mechanical reliability, an understanding of the origin of these stresses and the controlling deformation processes in thin films is needed. This review begins with a discussion of the basic techniques used for measuring stresses in thin films and for studying the mechanical properties of thin films. The proposed models for the origin of stresses in thin films are then reviewed. Finally, the effects of microstructure and substrate constraint on thin film deformation processes are discussed.Keywords
This publication has 107 references indexed in Scilit:
- Stress relaxation in thin aluminium filmsThin Solid Films, 1985
- I n s i t u stress measurement of refractory metal silicides during sinteringJournal of Applied Physics, 1984
- Vickers Indentation Curves of Magnesium Oxide (MgO)Journal of Tribology, 1984
- Thermal strain in thin lead films III: Dependences of the strain on film thickness and on grain sizeThin Solid Films, 1979
- Stresses in thin films: The relevance of grain boundaries and impuritiesThin Solid Films, 1976
- Defects in epitaxial multilayersJournal of Crystal Growth, 1975
- X-ray diffraction approach to grain boundary and volume diffusionJournal of Applied Physics, 1973
- Stress Relief and Hillock Formation in Thin Lead FilmsJournal of Applied Physics, 1970
- X-Ray Diffraction from a Binary Diffusion ZoneJournal of Applied Physics, 1970
- The relation between load and penetration in the axisymmetric boussinesq problem for a punch of arbitrary profileInternational Journal of Engineering Science, 1965