MEMS: Quo vadis in century XXI?
- 1 June 2000
- journal article
- Published by Elsevier in Microelectronic Engineering
- Vol. 53 (1-4) , 47-54
- https://doi.org/10.1016/s0167-9317(00)00264-1
Abstract
No abstract availableKeywords
This publication has 9 references indexed in Scilit:
- Adhesion-related failure mechanisms in micromechanical devicesTribology Letters, 1997
- Microfabricated hingesSensors and Actuators A: Physical, 1992
- The application of fine-grained, tensile polysilicon to mechanicaly resonant transducersSensors and Actuators A: Physical, 1990
- Resonant-microbridge vapor sensorIEEE Transactions on Electron Devices, 1986
- Polycrystalline silicon strain sensorsSensors and Actuators, 1985
- Stress Effects in Boron‐Implanted Polysilicon FilmsJournal of the Electrochemical Society, 1984
- Effect of phosphorus doping on stress in silicon and polycrystalline siliconJournal of Applied Physics, 1983
- Piezoresistive properties of polycrystalline siliconJournal of Applied Physics, 1976
- The resonant gate transistorIEEE Transactions on Electron Devices, 1967