Relation between yield and reliability of integrated circuits: experimental results and application to continuous early failure rate reduction programs
- 1 January 1996
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
The relation between yield and early failures as encountered in the field was investigated with several high volume IC's manufactured in several processes. A clear correlation between yield and reliability was found that obeys a simple model. The model also provides the ability to predict the FIT or PPM level of a given IC based on its yield. Using these results we illustrate how a wafer fab may improve the reliability level of its products in a controlled way.Keywords
This publication has 5 references indexed in Scilit:
- Reliability in VHSIC-level 1.25 mu m radiation-hard CMOS IC devicesPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Evidence of a correlation between process yields and reliability data for a rad-hard SOI technologyPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Reliability, yield and quality correlation for a particular failure mechanismPublished by Institute of Electrical and Electronics Engineers (IEEE) ,1993
- A yield improvement technique for IC layout using local design rulesIEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 1992
- Reliability defect detection and screening during processing-theory and implementationPublished by Institute of Electrical and Electronics Engineers (IEEE) ,1992