Application of diamond substrates for advanced high density packaging
- 24 April 1993
- journal article
- Published by Elsevier in Diamond and Related Materials
- Vol. 2 (5-7) , 1051-1058
- https://doi.org/10.1016/0925-9635(93)90272-4
Abstract
No abstract availableKeywords
This publication has 2 references indexed in Scilit:
- X-Ray study of the interface layer between low temperature deposited diamond film and the silicon substrateDiamond and Related Materials, 1993
- High-performance heat sinking for VLSIIEEE Electron Device Letters, 1981