Analysis of the reaction between 60Sn-40Pb solder with a Pd-Pt-Ag-Cu-Au alloy
- 1 February 1993
- journal article
- Published by Springer Nature in Journal of Electronic Materials
- Vol. 22 (2) , 185-194
- https://doi.org/10.1007/bf02665025
Abstract
No abstract availableKeywords
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