High-density and alignment-tolerant integration of monitoring photodetector arrays onto polymeric guided-wave components

This publication has 29 references indexed in Scilit:

• Soldering technology for optoelectronic packaging
  Published by Institute of Electrical and Electronics Engineers (IEEE) ,2002
• First polymeric splitter array with integrated PD-chip for multichannel power monitoring
  Published by Institute of Electrical and Electronics Engineers (IEEE) ,2002
• Controlled solder self-alignment sequence for an optoelectronic module without mechanical stops
  Published by Institute of Electrical and Electronics Engineers (IEEE) ,2002
• Compact multichannel in-line power monitor
  IEEE Photonics Technology Letters, 1999
• Thermosonic flip-chip bonding using longitudinal ultrasonic vibration
  IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B, 1998
• High-efficiency, zero-bias waveguide pin photodiodefor low-power-consumption optical hybrid modules
  Electronics Letters, 1997
• Integration of nonlinear optical polymer waveguides with InGaAs p-i-n photodiodes
  Applied Physics Letters, 1996
• Anisotropically Etched Silicon Mirrors for Optical Sensor Applications
  Journal of the Electrochemical Society, 1995
• Optical Surface Mount Technology
  Japanese Journal of Applied Physics, 1992
• An innovative bonding technique for optical chips using solder bumps that eliminate chip positioning adjustments
  IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1992