Studies on SiO2–SiO2 bonding with hydrofluoric acid. Room temperature and low stress bonding technique for MEMS
- 28 February 2000
- journal article
- Published by Elsevier in Sensors and Actuators A: Physical
- Vol. 79 (3) , 237-244
- https://doi.org/10.1016/s0924-4247(99)00246-0
Abstract
No abstract availableKeywords
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- Silicon fusion bonding for fabrication of sensors, actuators and microstructuresSensors and Actuators A: Physical, 1990
- Absolute Cross Sections for the Production of 18F via the 18O(p, n)18F ReactionRadiochimica Acta, 1979