Silicon fusion bonding for fabrication of sensors, actuators and microstructures
- 1 April 1990
- journal article
- Published by Elsevier in Sensors and Actuators A: Physical
- Vol. 23 (1-3) , 919-926
- https://doi.org/10.1016/0924-4247(90)87060-v
Abstract
No abstract availableKeywords
This publication has 9 references indexed in Scilit:
- A monolithic silicon accelerometer with integral air damping and overrange protectionPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- Silicon fusion bonding for pressure sensorsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- Ultra-stable, high-temperature pressure sensors using silicon fusion bondingSensors and Actuators A: Physical, 1990
- Single-crysytal silicon pressure sensors with 500 × overpressure protectionSensors and Actuators A: Physical, 1990
- Bonding of silicon wafers for silicon-on-insulatorJournal of Applied Physics, 1988
- Large Diameter Soi Wafers by Zone-Melting-RecrystallizationMRS Proceedings, 1987
- Silicon-to-silicon direct bonding methodJournal of Applied Physics, 1986
- A Field‐Assisted Bonding Process for Silicon Dielectric IsolationJournal of the Electrochemical Society, 1986
- Silicon microcavities fabricated with a new techniqueElectronics Letters, 1986