Copper substrate dissolution in eutectic Sn-Ag solder and its effect on microstructure
- 1 October 2000
- journal article
- Published by Springer Nature in Journal of Electronic Materials
- Vol. 29 (10) , 1214-1221
- https://doi.org/10.1007/s11664-000-0015-6
Abstract
No abstract availableThis publication has 4 references indexed in Scilit:
- Tin-silver-copper eutectic temperature and compositionMetallurgical and Materials Transactions A, 2000
- An improved numerical method for predicting intermetallic layer thickness developed during the formation of solder joints on Cu substratesJournal of Electronic Materials, 1999
- A numerical method for predicting intermetallic layer thickness developed during the formation of solder jointsJournal of Electronic Materials, 1996
- A viable tin-lead solder substitute: Sn-Ag-CuJournal of Electronic Materials, 1994