Inertial sensor technology using DRIE and wafer bonding with connecting capability
- 1 January 1999
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in Journal of Microelectromechanical Systems
- Vol. 8 (4) , 403-408
- https://doi.org/10.1109/84.809054
Abstract
No abstract availableThis publication has 8 references indexed in Scilit:
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