Applications of grain boundary diffusion studies to soldering and thermocompression bonding
- 1 September 1978
- journal article
- Published by Elsevier in Thin Solid Films
- Vol. 53 (2) , 183-191
- https://doi.org/10.1016/0040-6090(78)90033-0
Abstract
No abstract availableKeywords
This publication has 6 references indexed in Scilit:
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- Interdiffusion in the CuAu thin film system at 25°C to 250°CThin Solid Films, 1977
- A formalism for determining grain boundary diffusion coefficients using surface analysisSurface Science, 1976
- Low-temperature diffusion of copper through goldJournal of Applied Physics, 1976