Reduced Gold-Plating on Copper Leads for Thermocompression Bonding-Part I: Initial Characterization
- 1 September 1977
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Parts, Hybrids, and Packaging
- Vol. 13 (3) , 305-309
- https://doi.org/10.1109/tphp.1977.1135201
Abstract
No abstract availableKeywords
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