Three-dimensionally interconnected multi-bus-line bidirectional optical backplane
- 1 September 1999
- journal article
- Published by SPIE-Intl Soc Optical Eng in Optical Engineering
- Vol. 38 (9) , 1560-1566
- https://doi.org/10.1117/1.602207
Abstract
The concept of a three-dimensionally interconnected optical backplane for a high-performance system containing multichip module boards, operating at 850 nm, is introduced. The backplane reported here employs 2-D vertical-cavity surface-emitting lasers (VCSELs) and photodetector arrays as transceivers. By integrating 250-μm-pitch 2-D VCSELs, microlenses, and photodetector arrays into our backplane design, we have demonstrated a multi-bus-line optical backplane and experimentally realized this architecture with 2-D VCSEL and detector arrays while using the third dimension as the signal-propagating direction. Such an approach greatly increases the aggregate bandwidth of the backplane. Packaging issues such as misalignment, cross talk, and signal-to-noise ratio are studied. Eye diagrams up to 1.5 GHz were obtained with clear eyes, and the frequency response of a single bus line shows a bandwidth of 2.5 THz. © 1999 Society of Photo-Optical Instrumentation Engineers.Keywords
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