Effect of Ni layer thickness and soldering time on intermetallic compound formation at the interface between molten Sn-3.5Ag and Ni/Cu substrate
- 1 November 1999
- journal article
- Published by Springer Nature in Journal of Electronic Materials
- Vol. 28 (11) , 1251-1255
- https://doi.org/10.1007/s11664-999-0164-1
Abstract
No abstract availableKeywords
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