Microstructural Features of Lift-Off Phenomenon in Through-Hole Circuit Soldered by Sn-Bi Alloy
- 1 April 1998
- journal article
- Published by Elsevier in Scripta Materialia
- Vol. 38 (9) , 1333-1340
- https://doi.org/10.1016/s1359-6462(98)00059-1
Abstract
No abstract availableThis publication has 4 references indexed in Scilit:
- Properties of Sn-Bi Solders and Its Interface with Cu.The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits, 1997
- Role of tin content in the wetting of cu and au by tin-bismuth soldersJournal of Electronic Materials, 1994
- In search of new lead-free electronic soldersJournal of Electronic Materials, 1994
- The properties of tin-bismuth alloy soldersJOM, 1993