Tri-layer soft UV imprint lithography and fabrication of high density pillars
- 30 September 2006
- journal article
- Published by Elsevier in Microelectronic Engineering
- Vol. 83 (4-9) , 1664-1668
- https://doi.org/10.1016/j.mee.2006.01.268
Abstract
No abstract availableKeywords
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