Characterization of a colloidal Pd(II)-based catalyst dispersion for electroless metal deposition
- 8 March 1996
- journal article
- Published by Elsevier in Colloids and Surfaces A: Physicochemical and Engineering Aspects
- Vol. 108 (1) , 101-111
- https://doi.org/10.1016/0927-7757(95)03392-0
Abstract
No abstract availableThis publication has 20 references indexed in Scilit:
- Low voltage electron beam lithography in self-assembled ultrathin films with the scanning tunneling microscopeApplied Physics Letters, 1994
- Covalent Binding of Pd Catalysts to Ligating Self‐Assembled Monolayer Films for Selective Electroless Metal DepositionJournal of the Electrochemical Society, 1994
- Electroless Ni as a Refractory Ohmic Contact for n ‐ InPJournal of the Electrochemical Society, 1993
- Photopatterning and selective electroless metallization of surface-attached ligandsChemistry of Materials, 1993
- Projection x-ray lithography with ultrathin imaging layers and selective electroless metallizationOptical Engineering, 1993
- Deep UV Photochemistry of Chemisorbed Monolayers: Patterned Coplanar Molecular AssembliesScience, 1991
- Low Resistance Ohmic Contacts onto n ‐ InP by Palladium Electroless Bath DepositionJournal of the Electrochemical Society, 1990
- Use of Au-In-Pd and Pd-In Electroless Deposits for Ohmic Contacts on n-GaAsJournal of the Electrochemical Society, 1990
- Autocatalytic Deposition of Gold and Palladium onto n ‐ GaAs in Acidic MediaJournal of the Electrochemical Society, 1988
- A New Set of Printed-Circuit Technologies for the IBM 3081 Processor UnitIBM Journal of Research and Development, 1982