Reliability of 0.4 mm Pitch, 256‐pin Plastic Quad Flat Pack No‐clean and Water‐clean Solder Joints
- 1 January 1994
- journal article
- Published by Emerald Publishing in Soldering & Surface Mount Technology
- Vol. 6 (1) , 42-50
- https://doi.org/10.1108/eb037854
Abstract
No abstract availableKeywords
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