Realistic and efficient simulation of electro-thermal effects in VLSI circuits
- 1 September 1997
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Very Large Scale Integration (VLSI) Systems
- Vol. 5 (3) , 283-289
- https://doi.org/10.1109/92.609871
Abstract
Needs for electro-thermal simulation of VLSI circuits, as opposed to both the system and device levels, are analyzed. A system capable of modeling these effects in a realistic and sufficiently accurate way that uses a reasonable amount of CPU resources is presented. An innovative solver is also proposed. The system is used to study the importance of some three dimensional (3-D) effects as well as metallic connections. A complete example was treated to have an insight on the type of results to be expected and the corresponding costs in terms of CPU.Keywords
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