RF-system-on-package (SOP) for wireless communications
Top Cited Papers
- 7 August 2002
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Microwave Magazine
- Vol. 3 (1) , 88-99
- https://doi.org/10.1109/mmw.2002.990700
Abstract
No abstract availableKeywords
This publication has 6 references indexed in Scilit:
- RF-microwave multi-layer integrated passives using fully organic System on Package (SOP) technologyPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- A compact LTCC Ku-band transmitter module with integrated filter for satellite communication applicationsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Development of integrated three dimensional Bluetooth image reject filterPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- High-Q LTCC-based passive library for wireless system-on-package (SOP) module developmentIEEE Transactions on Microwave Theory and Techniques, 2001
- Multilayer thin-film MCM-D for the integration of high-performance RF and microwave circuitsIEEE Transactions on Components and Packaging Technologies, 2001
- A 1.9-GHz DECT CMOS power amplifier with fully integrated multilayer LTCC passivesIEEE Microwave and Wireless Components Letters, 2001