Thin-Film Packaging

This publication has 14 references indexed in Scilit:

• High-end computer packaging—VLSI scaling and materials science
  Journal of Vacuum Science & Technology A, 1985
• Microelectronic Packaging
  Scientific American, 1983
• Cost/Performance Single-Chip Module
  IBM Journal of Research and Development, 1982
• The Thin-Film Module as a High-Performance Semiconductor Package
  IBM Journal of Research and Development, 1982
• Semiconductors: The key to computational plenty
  Proceedings of the IEEE, 1982
• Thermal Conduction Module: A High-Performance Multilayer Ceramic Package
  IBM Journal of Research and Development, 1982
• A Multilayer Ceramic Multichip Module
  IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1980
• The Role of Hybrids in LSI Systems
  IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1979
• Impact of the LSI on High-Speed Computer Packaging
  IEEE Transactions on Computers, 1978
• On a Pin Versus Block Relationship For Partitions of Logic Graphs
  IEEE Transactions on Computers, 1971