Phase equilibria studies of Sn-Ag-Cu eutectic solder using differential cooling of Sn-3.8Ag-0.7Cu alloys
- 1 November 2003
- journal article
- Published by Springer Nature in Journal of Electronic Materials
- Vol. 32 (11) , 1297-1302
- https://doi.org/10.1007/s11664-003-0026-1
Abstract
No abstract availableKeywords
This publication has 8 references indexed in Scilit:
- Ag3Sn plate formation in the solidification of near ternary eutectic Sn–Ag–Cu alloysJournal of Materials Research, 2002
- Effects of cooling speed on microstructure and tensile properties of Sn–Ag–Cu alloysPublished by Elsevier ,2002
- Determination of the eutectic structure in the Ag-Cu-Sn systemJournal of Electronic Materials, 2002
- Pb-free solders for flip-chip interconnectsJOM, 2001
- Phase equilibria and the related properties of Sn-Ag-Cu based Pb-free solder alloysJournal of Electronic Materials, 2000
- Experimental and thermodynamic assessment of Sn-Ag-Cu solder alloysJournal of Electronic Materials, 2000
- Tin-silver-copper eutectic temperature and compositionMetallurgical and Materials Transactions A, 2000
- A viable tin-lead solder substitute: Sn-Ag-CuJournal of Electronic Materials, 1994