AlSiV and AlSiVPd films as alternatives for AlSiCu interconnect: microstructure and its impact on reliability
- 1 June 1994
- journal article
- Published by Elsevier in Thin Solid Films
- Vol. 246 (1-2) , 164-171
- https://doi.org/10.1016/0040-6090(94)90746-3
Abstract
No abstract availableThis publication has 14 references indexed in Scilit:
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