Effects of vanadium and chromium on aluminum electromigration
- 15 February 1987
- journal article
- Published by AIP Publishing in Journal of Applied Physics
- Vol. 61 (4) , 1392-1403
- https://doi.org/10.1063/1.338118
Abstract
A systematic study was made of electromigration in homogeneous Al-V and Al-Cr thin films. V and Cr concentrations were varied in the range of 0–2 wt. %, and films were prepared both with and without 1% Si. The addition of as little as 0.1% V caused significant improvements in lifetime relative to pure Al. In the most concentrated alloy studied, the activation energy of mass transport had increased from 0.54 eV for pure Al to 0.92 eV for Al-1.1% V. For the Al-Cr alloys, a maximum in lifetime was found at 0.4% Cr. Higher concentrations of Cr resulted in a gradual degradation of the enhanced lifetime. Lifetimes were reduced when 1% Si was added to either alloy system. Alloy microstructure was examined using transmission electron microscopy. Contrary to results for other Al alloys, lifetimes were reduced in films with extensive precipitation.This publication has 10 references indexed in Scilit:
- Rapidly solidifed Al-Cr alloys: structure and decomposition behaviourJournal of Materials Science, 1986
- Grain growth study in aluminum films and electromigration implicationsJournal of Applied Physics, 1985
- Layered and homogeneous films of aluminum and aluminum/silicon with titanium and tungsten for multilevel interconnectsIEEE Transactions on Electron Devices, 1985
- Lifetime and drift velocity analysis for electromigration in sputtered Al films, multilayers, and alloysSolid-State Electronics, 1983
- Electromigration effects in aluminum alloy metallizationJournal of Electronic Materials, 1974
- Coating, Mechanical Constraints, and Pressure Effects on ElectromigrationApplied Physics Letters, 1972
- Effect of Alloy Additions on Electromigration Failures in Thin Aluminum FilmsApplied Physics Letters, 1971
- Hillock-free aluminum thin films for electronic devicesMetallurgical Transactions, 1971
- The effect of copper additions on electromigration in aluminum thin filmsMetallurgical Transactions, 1971
- Reduction of Electromigration in Aluminum Films by Copper DopingIBM Journal of Research and Development, 1970