The effect of copper additions on electromigration in aluminum thin films
- 1 March 1971
- journal article
- 1970 electronic-materials-conference
- Published by Springer Nature in Metallurgical Transactions
- Vol. 2 (3) , 683-689
- https://doi.org/10.1007/bf02662722
Abstract
No abstract availableKeywords
This publication has 13 references indexed in Scilit:
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