Quasicrystalline (Al,Pd)-phase in dilute AlSiVPd films for use as reliable metallizations in ultralarge scale integration
- 15 October 1993
- journal article
- Published by Elsevier in Scripta Metallurgica et Materialia
- Vol. 29 (8) , 1017-1022
- https://doi.org/10.1016/0956-716x(93)90170-w
Abstract
No abstract availableThis publication has 24 references indexed in Scilit:
- Comparative study on phase formation in Al-Pd thin film by ion beam mixing and thermal annealingJournal of Materials Science, 1991
- Electromigration phenomena in AlSi and AlVSi thin alloy filmsThin Solid Films, 1990
- Stress migration resistance and contact characterization of Al–Pd–Si interconnects for very large scale integrationsJournal of Vacuum Science & Technology B, 1990
- Corrosion resistance of Al-Pd-Si conductorIEEE Transactions on Electron Devices, 1990
- Development of highly reliable Al-Si-Pd alloy interconnections for VLSIIEEE Transactions on Electron Devices, 1990
- Precipitation from metastable solid solutions in aluminum rich AlV thin filmsScripta Metallurgica, 1987
- Effects of vanadium and chromium on aluminum electromigrationJournal of Applied Physics, 1987
- A comparison of the decagonal phase in rapidly solidified AlMn and AlPd alloysScripta Metallurgica, 1986
- The Al−Pd (Aluminum-Palladium) systemBulletin of Alloy Phase Diagrams, 1986
- A Structural Study of Vapour-Deposited Al–Pd AlloysPhysica Status Solidi (a), 1982