PMOS transistors in LPCVD polycrystalline silicon-germanium films

Abstract
P-channel MOS thin-film transistors (TFTs) have been fabricated in low-pressure chemical vapor deposition (LPCVD) polycrystalline silicon-germanium (poly-SiGe) films using either a low-temperature (<or=600 degrees C) process or a high-temperature (up to 950 degrees C) process. Poly-SiGe TFT technology allows the use of lower anneal temperatures and shorter anneal times as compared to a poly-Si TFT technology. The devices fabricated show good transistor characteristics after hydrogenation to reduce the number of electrically active traps in their active channel region.

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