Reliability investigations of different tape metallizations for TAB-outer lead bonding
- 1 January 1994
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B
- Vol. 17 (4) , 537-546
- https://doi.org/10.1109/96.338720
Abstract
No abstract availableKeywords
This publication has 10 references indexed in Scilit:
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