Grain boundary influence on the electrical resistance of submicron grained copper
- 16 March 1990
- journal article
- research article
- Published by Wiley in Physica Status Solidi (a)
- Vol. 118 (1) , K27-K29
- https://doi.org/10.1002/pssa.2211180146
Abstract
No abstract availableThis publication has 4 references indexed in Scilit:
- Scattering of conductivity electrons on grain boundaries in metalsPhysica Status Solidi (a), 1988
- Temperature-dependent resistivity measurements on polycrystalline SiO2-covered thin nickel filmsThin Solid Films, 1987
- Temperature-dependent resistivity measurements on polycrystalline SiO2-covered thin gold filmsThin Solid Films, 1987
- Electrical-Resistivity Model for Polycrystalline Films: the Case of Arbitrary Reflection at External SurfacesPhysical Review B, 1970