A technology for implantable hermetic packages. Part 1: Design and materials
- 1 July 1981
- journal article
- research article
- Published by Springer Nature in Medical & Biological Engineering & Computing
- Vol. 19 (4) , 398-402
- https://doi.org/10.1007/bf02441301
Abstract
No abstract availableKeywords
This publication has 6 references indexed in Scilit:
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- Silicone-rubber adhesives as encapsulants for microelectronic implants; effect of high electric fields and of tensile stressMedical & Biological Engineering & Computing, 1977
- The Encapsulation of Microelectronic Devices for Long-Term Surgical ImplantationIEEE Transactions on Biomedical Engineering, 1976
- A vacuum centrifuge for void-free potting of implantable hybrid microcircuits in siliconeMedical & Biological Engineering & Computing, 1975
- The sensations produced by electrical stimulation of the visual cortexThe Journal of Physiology, 1968
- A metal-insulator-silicon junction sealIEEE Transactions on Electron Devices, 1968