A technology for implantable hermetic packages. Part 2: An implementation
- 1 July 1981
- journal article
- Published by Springer Nature in Medical & Biological Engineering & Computing
- Vol. 19 (4) , 403-405
- https://doi.org/10.1007/bf02441302
Abstract
No abstract availableKeywords
This publication has 4 references indexed in Scilit:
- A technology for implantable hermetic packages. Part 1: Design and materialsMedical & Biological Engineering & Computing, 1981
- In search of the reliable microelectronic implantTrends in Neurosciences, 1978
- Silicone-rubber adhesives as encapsulants for microelectronic implants; effect of high electric fields and of tensile stressMedical & Biological Engineering & Computing, 1977
- A vacuum centrifuge for void-free potting of implantable hybrid microcircuits in siliconeMedical & Biological Engineering & Computing, 1975