The effect of microstructure on the resistance to electromigration of AlCu thin film conductors
Open Access
- 1 February 1991
- journal article
- Published by Elsevier in Thin Solid Films
- Vol. 196 (1) , 47-63
- https://doi.org/10.1016/0040-6090(91)90173-u
Abstract
No abstract availableKeywords
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