The Hardness Assurance Wafer Probe - HAWP
- 1 January 1983
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Nuclear Science
- Vol. 30 (6) , 4345-4350
- https://doi.org/10.1109/TNS.1983.4333135
Abstract
Complete radiation sensitivity assessments of integrated circuits can now be performed at the wafer level using a new system, the Hardness Assurance Wafer Probe, HAWP. This system utilizes a pulsed Nd: YAG infrared laser impinging on the backside of the wafer to evaluate the transient behavior of the circuits. A low energy X ray source collimated to a single die site actually performs total dose irradiations. Finally, special electrical measurements are used to enable a prediction of the neutron sensitivity of bipolar devices. The HAWP System is described and correlations of wafer probe results to conventional radiation tests for a digital part type are provided.Keywords
This publication has 5 references indexed in Scilit:
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