High-Rate Selective Etching of a-Si:H Using Hydrogen Radicals
- 1 May 1994
- journal article
- Published by IOP Publishing in Japanese Journal of Applied Physics
- Vol. 33 (5A) , L621
- https://doi.org/10.1143/jjap.33.l621
Abstract
A high-rate selective etching method of hydrogenated amorphous silicon (a-Si:H) using hydrogen radicals is presented. A very high etch rate of 2.7 µm/min was obtained at 50°C using a microwave hydrogen afterglow method. However, amorphous silicon nitride ( a-SiN1.2:H), silicon oxide ( SiO2), silicon carbide ( a-SiC0.5:H), and Al films were not etched under the same conditions. These results suggest that high-rate selective etching of a-Si:H can be achieved using hydrogen radicals. This method is suitable for the fabrication of large-area devices.Keywords
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