High density packaging technology ultra thin package & new tab package
- 1 September 1989
- journal article
- Published by Springer Nature in Journal of Electronic Materials
- Vol. 18 (5) , 633-643
- https://doi.org/10.1007/bf02657479
Abstract
No abstract availableKeywords
This publication has 2 references indexed in Scilit:
- Moisture Resistance Degradation of Plastic LSIs by Reflow SolderingPublished by Institute of Electrical and Electronics Engineers (IEEE) ,1985
- The relationship between moisture resistance and epoxy molding compounds in integrated circuitsJournal of Electronic Materials, 1984