The relationship between moisture resistance and epoxy molding compounds in integrated circuits
- 1 March 1984
- journal article
- Published by Springer Nature in Journal of Electronic Materials
- Vol. 13 (2) , 231-250
- https://doi.org/10.1007/bf02656677
Abstract
No abstract availableKeywords
This publication has 7 references indexed in Scilit:
- Corrosion of Aluminum IC Metaillization with Defective Surface Passivation LayerPublished by Institute of Electrical and Electronics Engineers (IEEE) ,1980
- The Influence of Plastic Encapsulants and Passivation Layers on the Corrosion of Thin Aluminium Films Subjected to Humidity Stress8th Reliability Physics Symposium, 1979
- Developments likely to improve the reliability of plastic encapsulated devicesMicroelectronics Reliability, 1978
- Factors governing aluminium interconnection corrosion in plastic encapsulated microelectronic devicesMicroelectronics Reliability, 1977
- The Effect of Impurities on the Corrosion of Aluminum Metallization8th Reliability Physics Symposium, 1976
- Factors contributing to the corrosion of the aluminum metal on semiconductor devices packaged in plasticsMicroelectronics Reliability, 1976
- Principles of Corrosion8th Reliability Physics Symposium, 1974