Characterization of the growth of intermetallic interfacial layers of Sn-Ag and Sn-Pb eutectic solders and their composite solders on Cu substrate during isothermal long-term aging
- 1 November 1999
- journal article
- research article
- Published by Springer Nature in Journal of Electronic Materials
- Vol. 28 (11) , 1209-1215
- https://doi.org/10.1007/s11664-999-0159-y
Abstract
No abstract availableKeywords
This publication has 13 references indexed in Scilit:
- Microstructure evolution of eutectic Sn-Ag solder jointsJournal of Electronic Materials, 1994
- The effect of reflow process variables on the wettability of lead-free soldersJOM, 1993
- Progress in the design of new lead-free solder alloysJOM, 1993
- Converting to lead-free solders: An automotive industry perspectiveJOM, 1993
- The growth of Cu-Sn intermetallics at a pretinned copper-solder interfaceMetallurgical Transactions A, 1992
- Analysis of low-temperature intermetallic growth in copper-tin diffusion couplesMetallurgical Transactions A, 1992
- Effects of intermetallic formation at the interface between copper and lead-tin solderJournal of Materials Science, 1988
- The formation of Cu3Sn intermetallic on the reaction of cu with 95Pb-5Sn solderJournal of Electronic Materials, 1986
- Observations on the Growth and Impact of Intermetallic Compounds on Tin‐Coated SubstratesCircuit World, 1983
- Interdiffusion and reaction in bimetallic Cu-Sn thin filmsActa Metallurgica, 1973