The influence of feature sidewall tolerance on minimum absorber thickness for LIGA x-ray masks
Open Access
- 30 November 1999
- journal article
- Published by IOP Publishing in Journal of Micromechanics and Microengineering
- Vol. 9 (4) , 353-361
- https://doi.org/10.1088/0960-1317/9/4/311
Abstract
Minimizing mask absorber thickness is an important practical concern in producing very small features by the LIGA process. To assist in this minimization, we have developed coupled numerical models describing both the exposure and development of a thick polymethyl methacrylate (PMMA) resist. The exposure model addresses multi-wavelength, one-dimensional x-ray transmission through multiple beam filters, through the mask substrate and absorber, and the subsequent attenuation and photon absorption in the PMMA resist. The development model describes one-dimensional dissolution of a feature and its sidewalls, taking into account the variation in absorbed dose through the PMMA thickness. These exposure and development models are coupled in a single interactive code, permitting the automated adjustment of mask absorber thickness to yield a prescribed sidewall taper or dissolution distance. We have used this tool to compute the minimum required absorber thickness yielding a prescribed sidewall tolerance for exposures performed at the ALS, SSRL and NSLS synchrotron sources. Results are presented as a function of the absorbed dose for a range of the prescribed sidewall tolerance, feature size, PMMA thickness, mask substrate thickness and the development temperature.Keywords
This publication has 9 references indexed in Scilit:
- Resist dissolution rate and inclined-wall structures in deep x-ray lithographyJournal of Micromechanics and Microengineering, 1998
- PMMA development studies using various synchrotron sources and exposure conditionsPublished by SPIE-Intl Soc Optical Eng ,1998
- Transport limitations in electrodeposition for LIGA microdevice fabricationPublished by SPIE-Intl Soc Optical Eng ,1998
- New development strategies for high aspect ratio microstructuresMicrosystem Technologies, 1998
- X-Ray masks for very deep X-Ray lithographyMicrosystem Technologies, 1998
- Calculation and experimental determination of the structure transfer accuracy in deep x-ray lithographyJournal of Micromechanics and Microengineering, 1997
- Simulational studies of energy deposition and secondary processes in deep x-ray lithographyJournal of Micromechanics and Microengineering, 1997
- Accuracy Limits And Potential Applications Of The LIGA Technique In Integrated OpticsPublished by SPIE-Intl Soc Optical Eng ,1987
- Fabrication of microstructures with high aspect ratios and great structural heights by synchrotron radiation lithography, galvanoforming, and plastic moulding (LIGA process)Microelectronic Engineering, 1986