Compliance metrics for the inclined gull-wing, spider J-bend, and spider gull-wing lead designs for surface mount components
- 1 January 1991
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 14 (4) , 771-779
- https://doi.org/10.1109/33.105132
Abstract
No abstract availableKeywords
This publication has 7 references indexed in Scilit:
- Reliability figures of merit for surface-soldered leadless chip carriers compared to leaded packagesPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- Compliance metric for the S-bend lead design for surface mount components, with application to clip-leadsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Compliance metrics for surface mount component lead designPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Surface-mount attachment reliability of clip-leaded ceramic chip carriers on FR-4 circuit boardsIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1989
- Comparative compliance of representative lead designs for surface-mounted componentsIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1989
- Reliability figures of merit for surface-soldered leadless chip carriers compared to lead packagesIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1989
- The IEEE Compliant Lead Task ForceIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1987