Compliance metric for the S-bend lead design for surface mount components, with application to clip-leads
- 30 December 2002
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- p. 1104-1114
- https://doi.org/10.1109/ectc.1993.346696
Abstract
No abstract availableThis publication has 9 references indexed in Scilit:
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- Compliance metrics for the generalized S-bend lead design for surface-mount componentsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- Compliance metrics for the inclined gull-wing, spider J-bend, and spider gull-wing lead designs for surface mount componentsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Compliance metrics for surface mount component lead designPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
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- Compliance metrics for the inclined gull-wing, spider J-bend, and spider gull-wing lead designs for surface mount componentsIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1991
- Surface-mount attachment reliability of clip-leaded ceramic chip carriers on FR-4 circuit boardsIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1989
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