Hot air leveled tin: solderability and some related properties
- 13 January 2003
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
No abstract availableKeywords
This publication has 5 references indexed in Scilit:
- Solderability degradation models for fusible tin alloy coatings on copper substratesIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1988
- Grain size effect of electro-plated tin coatings on whisker growthJournal of Materials Science, 1982
- Interdiffusion and formation of intermetallic compounds in tin-copper alloy surface coatingsSurface Technology, 1977
- Intermetallic Growth and Contact Resistance of Tin Contacts After AgingIEEE Transactions on Parts, Hybrids, and Packaging, 1976
- The Growth of Intermetallic Compounds on Common Basis Materials Coated with Tin and Tin-Lead AlloysTransactions of the IMF, 1976