Fatigue crack-growth behavior of Sn-Ag-Cu and Sn-Ag-Cu-Bi lead-free solders
- 1 August 2002
- journal article
- Published by Springer Nature in Journal of Electronic Materials
- Vol. 31 (8) , 879-886
- https://doi.org/10.1007/s11664-002-0199-z
Abstract
No abstract availableKeywords
This publication has 19 references indexed in Scilit:
- Effect of thermal cycles on the mechanical strength of quad flat pack leads/Sn-3.5Ag-X (X=Bi and Cu) solder jointsJournal of Electronic Materials, 1999
- Fatigue of MaterialsPublished by Cambridge University Press (CUP) ,1998
- Effect of Substrate Preheating on Solderability Performance as a Guideline for Assembly Process Development Part 1: Baseline Analysis *Soldering & Surface Mount Technology, 1996
- The mechanical behavior of interconnect materials for electronic packagingJOM, 1996
- Metallurgy of low temperature Pb-free solders for electronic assemblyInternational Materials Reviews, 1995
- Low Cycle Fatigue of Sn96 Solder With Reference to Eutectic Solder and a High Pb SolderJournal of Electronic Packaging, 1991
- Overview of Crack Closure at Near-Threshold Fatigue Crack Growth LevelsPublished by ASTM International ,1988
- A Fracture Mechanics Approach to Creep Crack GrowthPublished by ASTM International ,1976
- Fatigue Crack Growth During Gross Plasticity and the J-IntegralPublished by ASTM International ,1976
- Relevance of Nonlinear Fracture Mechanics to Creep CrackingPublished by ASTM International ,1976