On the formation of voids in thin-film metal interconnects
- 1 December 1997
- journal article
- Published by Elsevier in Scripta Materialia
- Vol. 37 (11) , 1805-1810
- https://doi.org/10.1016/s1359-6462(97)00342-4
Abstract
No abstract availableKeywords
This publication has 5 references indexed in Scilit:
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- Effect of a surface layer on the stress relaxation of thin filmsJournal of Vacuum Science & Technology A, 1996
- Mechanical Stress in VLSI Interconnections: Origins, Effects, Measurement, and ModelingMRS Bulletin, 1995
- Deformation mechanisms of Al films on oxidized Si wafersJournal of Materials Research, 1994
- Stress-induced void formation in metallization for integrated circuitsMaterials Science and Engineering: R: Reports, 1993