Three-dimensional finite-element investigation of current crowding and peak temperatures in VLSI multilevel interconnections
- 1 July 1993
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Electron Devices
- Vol. 40 (7) , 1344-1347
- https://doi.org/10.1109/16.216444
Abstract
No abstract availableThis publication has 5 references indexed in Scilit:
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