Three dimensional finite element determination of current density and temperature distributions in pillar vias
- 9 December 2002
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- p. 343-345
- https://doi.org/10.1109/vmic.1991.153020
Abstract
No abstract availableKeywords
This publication has 2 references indexed in Scilit:
- Finite-element determination of interconnect track overheatingElectronics Letters, 1989
- Electromigration—A brief survey and some recent resultsIEEE Transactions on Electron Devices, 1969