Millimeter-wave characteristics of flip-chip interconnects for multichip modules
- 1 January 1998
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Microwave Theory and Techniques
- Vol. 46 (12) , 2264-2268
- https://doi.org/10.1109/22.739208
Abstract
Electromagnetic simulation and measurement data of flip-chip transitions are presented. First-order effects are identified and design criteria for millimeter-wave multichip in- terconnects are derived. Results cover chip detuning and bump geometry as well as simplified modeling. In a coplanar environ- ment, the flip-chip scheme provides interconnects with excellent low-reflective properties. For conductor-backed structures, par- asitic modes occur leading to unwanted crosstalk. These effects dominate the behavior so that overall performance of the flip- chip scheme can be evaluated properly only in conjunction with the actual motherboard packaging setup.Keywords
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