Investigation of MMIC flip chips with sealants for improved reliability without hermeticity
- 23 December 2002
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- Vol. 1, 239-242
- https://doi.org/10.1109/mwsym.1996.508502
Abstract
No abstract availableKeywords
This publication has 3 references indexed in Scilit:
- High yield GaAs flip-chip MMICs lead to low cost T/R modulesPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Reducing the effects of the mounting substrate on the performance of GaAs MMIC flip chipsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Precision flip-chip solder bump interconnects for optical packagingIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1992