Advanced packaging technologies on 3D stacked LSI utilizing the micro interconnections and the layered microthin encapsulation
- 13 November 2002
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- No. 05695503,p. 353-360
- https://doi.org/10.1109/ectc.2001.927748
Abstract
The advanced 3D stacking technologies are discussed in this paper. They are the microbumping in 20 /spl mu/m pitch, the basic processes of the advanced bonding processes for the high precision and the reliable interconnections, the novel technologies to encapsulate the layered microthin gaps less than 10 /spl mu/m, and the non-destructive inspection. These technologies are confirmed to realize the 3D stacked LSI structure, and it will be expanded to the advanced system packaging technologies in the near future.Keywords
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